Layer by Layer Decap Decapsulation is a process that most failure analysis labs use on a routine basis. The F/A uses our patent pending laser technology to allow an operator to remove individual layers of the mold compound all the way through the lead frames to the substrate. The F/A Decap process is 100% controllable by the operator through a Graphic User Interface (GUI). The operator can remove the entire compound, individual layers (operator determines layer thickness) or sections of the mold compound (operator defined). This controllable process allows the device to go directly into many other testing procedures such as wire pull or even electrical test in some cases. The F/A can import images from a variety of testing processes such as C-SAM, SEM, SAM and even X-RAY to show the operator exactly where the area of concern is within the sample. The F/A also eliminates the need for costly, dangerous, and hazardous chemicals with the comfort of knowing the process is safe and accurate. Cross - Sectioning Cross-sectioning is another method commonly used in the failure analysis process. Until the F/A was introduced, this process was normally done with a diamond saw. Unlike the diamond saw the F/A utilizes our patent pending laser cross-sectioning process to provide a clean and accurate dissection without damaging the sample. The F/A allows the operator to import images from a variety of testing procedures such as C-SAM, SEM, SAM and even X-RAY to show the operator exactly where the area of concern is within the sample. Once the area of concern is defined, the operator can utilize the Graphic User Interface (GUI) to define the cross-section. With a beam width of less than 25 microns the system can even cross-section a solder ball without damaging the sample.   No diamond saw   Clean and accurate dissection   No damage to sample   Operator easily imports C-SAM, SEM, SAM and X-RAY images   Graphic User Interface "GUI" defines the cross-section   Beam width of less than 25 microns More Laser, Less Acid Part Construction Database This module allows the operator to choose a part type from a section of images stored within a database. The images stored are generic samples of different components ranging from BGA’s, Flip Chip’s, mBGA’s, and many others. The image provides basic part construct characteristic to aid an operator in determining die positioning, mold compound height and lead wire positioning. This option is designed for the user that does not have access to a SAM, C-SAM®, SEM or X-RAY machine to provide failure analysis images.   Operator chooses part type stored within a database   Images stored range from BGA’s, FLIP CHIP’s, MBGA’s   Image provides basic part characteristics such as mold compound height and lead wire positioning. This option is designed for the users that do not have access to a C-SAM®, SEM or X-RAY images. Step and Repeat Fixturing This option allows larger quantities of the same ICs to be processed on a multiple part holding fixture. A “Step and Repeat” software tool is utilized to set up rows and columns. The fixture is loaded, processed, and unloaded until the total batch run is complete   Used for large quantity of the same IC's   Multiple park holding fixture   Step and Repeat software   Fixture loaded, processed and unloaded until batch completion