Suitable for some meso-scale (material thickness up to 1 mm) and lots of micro-scale applications   Case study focused on micro-scale application Hard Disk Texturing Nd:Vanadate IR laser, 4 W, 200 kHz, 80 ns Solar Cell Scribing Nd:YAG IR laser, scan head, 360 in/min, 9 W, 6 kHz. Nd:YAG Green laser, xy table, 360 in/min, 0.3-0.5 W, 25 kHz ITO Scribing for Flat Panel Display (FPD) Film Scribing Nd:YAG green laser, CrNiAu coating on Zr:Oxide ceramic-substrate, 1µm coating, 2.5 mm substrate, required scribe line width 10 µm, average power 0.5 W, 30 kHz. Diamond Cutting/Drilling/Structuring Nd:YAG green laser, average power: 9.0 W, pulse width: 150 ns Cycle time: ~ 90 seconds/piece Machining Dielectric Materials - Sapphire Laser sapphire parts, Nd:YAG green laser, 9.0 W, 150 ns pulse width Cycle time: 138 sec for ID and 430 s for OD, and 568 s per piece Exit hole Machining Dielectric Materials - Alumina Percussion drilling with Nd:YAG green laser, as-drilled hole array, 10 mil thick 99% alumina sheet, 11.0 W, 50 ms/hole Entry side Exit side Lead Frame Separation Nd:YAG green laser, average power: 9.0 W, pulse width: 150 ns Silicon Slotting/Scribing Nd:YAG green laser, average power: 11 W, pulse width: 13 ns, pulse repetition rate: 50 kHz, slot width: 200 µm Silicon Scribing QS Nd:YAG UV (355 nm) laser Processing: Scribe on the die street to remove 8 micron thick glass layer Scribing speed = 100 mm/s Results: HAZ was minimized; no damage to the adjacent die. 3D Marking inside Glass QS Nd:YAG UV (355 nm) laser Proper absorption and focusing depth Programmable Z movement Wire Stripping Q-switched Nd:YAG, DUV (266 nm), pulse width: 5 ns, pulse repetition rate: 10 Hz, cut width: 20 µm, cut depth: <10 µm