The Ultralit was specifically designed with the Semiconductor Failure Analysis Lab in mind. The system utilizes and incorporates industry standard testing methods to solve the problems faced everyday in the Semiconductor Industry. The Ultralit utilizes a patent pending multi wavelength Laser process in conjunction with the latest Alpha Spectrometry and R.I.E technology to provide clear and precise samples. The Ultralit provides a multitude of safe and economical processes. Decapsulation is a process that most failure analysis labs use on a routine basis. The Ultralit uses our patent pending laser technology to allow an operator to remove individual layers of the mold compound all the way through the lead frames to the substrate. The Ultralit Decap process is 100% controllable by the operator through a Graphical User Interface (GUI). The operator can remove the entire compound, individual layers (operator determines layer thickness) or sections of the mold compound (operator defined). This controllable process allows the device to go directly into many other testing procedures such as wire pull or even electrical test in some cases. The Ultralit can import images from a variety of testing processes such as C-SAM, SEM, SAM and even X-RAY to show the operator exactly where the area of concern is within the sample. The Ultralit also eliminates the need for costly, dangerous, and hazardous chemicals with the comfort of knowing the process is safe and accurate.